sector-technologies.com

Sector-Technologies

Opening - Sample Prep. Design and product eng. Tester for design debug. Design Debug - timing validation. Tester HW and SW. ATE Digital test instrument. ATE Mixed Signal MTMIXW. PCB- Pack. Fail. Analysis. CAD interface - NEXS. Circuit Edit - FIB. IR lenses for EMMI. Testers and EDA tools. Localize Fault in Package. Testers and EDA tools. Enable new Failure Analysis support. Best Performance for Digital (incl DDR2/DDR3), MixWave Testing. Localize Fault in Package. 10µm resolution thanks to TeraHertz.

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Sector-Technologies | sector-technologies.com Reviews

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Opening - Sample Prep. Design and product eng. Tester for design debug. Design Debug - timing validation. Tester HW and SW. ATE Digital test instrument. ATE Mixed Signal MTMIXW. PCB- Pack. Fail. Analysis. CAD interface - NEXS. Circuit Edit - FIB. IR lenses for EMMI. Testers and EDA tools. Localize Fault in Package. Testers and EDA tools. Enable new Failure Analysis support. Best Performance for Digital (incl DDR2/DDR3), MixWave Testing. Localize Fault in Package. 10µm resolution thanks to TeraHertz.

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6 electrical test

7 ate testers

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10 localization

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Sector-Technologies | sector-technologies.com Reviews

https://sector-technologies.com

Opening - Sample Prep. Design and product eng. Tester for design debug. Design Debug - timing validation. Tester HW and SW. ATE Digital test instrument. ATE Mixed Signal MTMIXW. PCB- Pack. Fail. Analysis. CAD interface - NEXS. Circuit Edit - FIB. IR lenses for EMMI. Testers and EDA tools. Localize Fault in Package. Testers and EDA tools. Enable new Failure Analysis support. Best Performance for Digital (incl DDR2/DDR3), MixWave Testing. Localize Fault in Package. 10µm resolution thanks to TeraHertz.

INTERNAL PAGES

sector-technologies.com

1

Sample Prep - Physical Prep - Sector-Technologies

http://www.sector-technologies.com/solutions/sample.html

Opening - Sample Prep. Design and product eng. Tester for design debug. Design Debug - timing validation. Tester HW and SW. ATE Digital test instrument. ATE Mixed Signal MTMIXW. PCB- Pack. Fail. Analysis. CAD interface - NEXS. Circuit Edit - FIB. IR lenses for EMMI. Solutions for Sample Preparation. Enabling your Physical analysis:. Package opening, Cross section, Backside Silicon access, Metrology, Delayering. Backside silicon metrology is enabling controlling your different sample preparation. Sector T...

2

R&D lab components - Sector-Technologies

http://www.sector-technologies.com/solutions/r-d-lab-components.html

Opening - Sample Prep. Design and product eng. Tester for design debug. Design Debug - timing validation. Tester HW and SW. ATE Digital test instrument. ATE Mixed Signal MTMIXW. PCB- Pack. Fail. Analysis. CAD interface - NEXS. Circuit Edit - FIB. IR lenses for EMMI. From Optics to Nano. High end solutions for R&D laboratories: flexible and innovative techniques. Your lab, our solutions. There are many other specific applications that we are serving, for instance:. As reference, the IR. Using innovative s...

3

Elite - Sector-Technologies

http://www.sector-technologies.com/products/elite.html

Opening - Sample Prep. Design and product eng. Tester for design debug. Design Debug - timing validation. Tester HW and SW. ATE Digital test instrument. ATE Mixed Signal MTMIXW. PCB- Pack. Fail. Analysis. CAD interface - NEXS. Circuit Edit - FIB. IR lenses for EMMI. Enhanced Lock-in Thermal Emission. From Package fault isolation to complementary solution to Laser technique/ Obirch. Defective or underperforming semiconductor. Thermography (LIT) to accurately and efficiently locate these areas of interest.

4

Circuit Edit - Sector-Technologies

http://www.sector-technologies.com/solutions/circuit-edit.html

Opening - Sample Prep. Design and product eng. Tester for design debug. Design Debug - timing validation. Tester HW and SW. ATE Digital test instrument. ATE Mixed Signal MTMIXW. PCB- Pack. Fail. Analysis. CAD interface - NEXS. Circuit Edit - FIB. IR lenses for EMMI. Solution for reducing time to market for new design. When developing new product, having your 1. Silicon, you want to jump over any design issue and validate your new design from your first silicon. A time to market ‘enabler’. Sector Technolo...

5

Electrical Failure Analysis - Sector-Technologies

http://www.sector-technologies.com/solutions/electrical-failure-analysis.html

Opening - Sample Prep. Design and product eng. Tester for design debug. Design Debug - timing validation. Tester HW and SW. ATE Digital test instrument. ATE Mixed Signal MTMIXW. PCB- Pack. Fail. Analysis. CAD interface - NEXS. Circuit Edit - FIB. IR lenses for EMMI. Electrical Failure Analysis ( EFA. Providing ALL localization solutions for EFA (Electrical Failure Analysis). Wide range of techniques ( EMMI. Highest Performance/ Resolution - validated for 32nm node. Fault isolation what’s for? Since there...

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dcgsystems.co.jp

グループ概要 | 企業情報 | DCGシステムズ

http://www.dcgsystems.co.jp/company/group

DCG Systems, Inc. 3400 W. Warren Avenue Fremont, CA 94538, U.S.A. URL : http:/ www.dcgsystems.com/. DCG Systems' corporate headquarters is located in Fremont, California. DCG Systems International Pte. Ltd. 26/F Prudential Tower,. 30 Cecil Street, Singapore 049712. T: 65 6824 8295 F: 65 6824 8334. Sales and support offices. DCG Systems, Taiwan. 6F-7,No.8, Ziqiang S. Rd., Zhubei City, HsinchuCounty 30264, Taiwan. DCG Systems, Korea. Suite 307, Dongtan Platinum 90-9. Bansong-dong, Hwasung-si, Gyeonggi-do.

conference.vde.com

ESREF 2014 - Welcome

http://conference.vde.com/esref/Pages/default.aspx

25th EUROPEAN SYMPOSIUM ON RELIABILITY OF ELECTRON DEVICES,. FAILURE PHYSICS AND ANALYSIS. 2909 - 02.10.2014 - TU Berlin. ESREF 2014, the 25th anniversary of the European Symposium on Reliability of Electron Devices, Failure Physics and Analysis will take place in Berlin (Germany) from September 29th to October 2nd, 2014. A word from the general chair. To characterize the dynamic potential of Berlin, I personally like to. For the first time, the European FIB User Group, EFUG, is integrated as one large t...

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Opening - Sample Prep. Design and product eng. Tester for design debug. Design Debug - timing validation. Tester HW and SW. ATE Digital test instrument. ATE Mixed Signal MTMIXW. PCB- Pack. Fail. Analysis. CAD interface - NEXS. Circuit Edit - FIB. IR lenses for EMMI. Testers and EDA tools. Localize Fault in Package. Testers and EDA tools. Enable new Failure Analysis support. Best Performance for Digital (incl DDR2/DDR3), MixWave Testing. Localize Fault in Package. 10µm resolution thanks to TeraHertz.

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